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Σπίτι προϊόντα

HDI PCB PCB Prototype Mass Production Minimum Line Space 0.075mm High Density Interconnect Circuit Board Services

MOQ:	1 πάνελ
τιμή:	Διαπραγματεύσιμα
Payment Terms:	T/T

Detail Information

Περιγραφή προϊόντων

Detail Information

Place of Origin:

China

Πιστοποίηση:

ISO9001, ISO13485,TS16949

Τύπος προϊόντος:

8 στρώσεις HDI PCB

Υλικό:

FR4 Υψηλή TG S1000-2M

Πάχος Cu:

1OZ

Μάσκα συγκόλλησης:

Μαύρη μάσκα

Τύπος εξυπηρέτησης:

Πρωτότυπο PCB/Μαζική παραγωγή

Δοκιμές:

Δοκιμή AOI

Έλεγχος αντίστασης:

± 10%

Ελάχιστη γέφυρα μάσκας συγκόλλησης:

0,08 χλστ

Συσκευασία λεπτομέρειες:

Συσκευή Vacumm

Επισημαίνω:

HDI PCB prototype services

high density interconnect circuit board

PCB mass production 0.075mm

Περιγραφή προϊόντων

Product Description:

Product type	8 layer HDI printed circuit board
Material	FR4 High TG 1.6mm
Copper thickness	1/H/H/H/H/H/H/1 oz
Surface finish	EING
Technology	Blind holes and resin plugging
Soldermask	Black
Line width/space	0.1mm

Why Blind Via hole in HDI PCB

Microvias and stacked microvias can be desinged in High Density Interconnect circuit boards, also known as HDI PCBs, to enable complex interconnections in advanced designs.

Microvias, stacked microvias and via-in-pad design allow miniaturization for higher functionality in less space and can accommodate large pin-count chips such as the ones used in cell phones and tablets. Microvias will help reduce layer count in printed circuit board designs while enabling higher routing density and eliminating the need for through vias.

Consumers' growing demand for more functionality in compact and portable electronic devices—including PDAs, mobile phones, and AI products—is pushing the industry toward smaller feature sizes, finer process geometries, and more compact printed circuit boards. For engineers addressing these evolving requirements, the adoption of high-density interconnect (HDI) technology has become essential.

HDI PCB technology enables the production of circuit boards with through-hole, blind, or buried vias without relying on conventional mechanical drilling methods. To successfully implement HDI, users must not only evaluate and apply this next-generation technology, but also understand its limitations in areas such as layer stack-up design, via and microvia formation, achievable feature sizes, and the key distinctions between HDI and conventional printed circuit board technologies.

Ετικέττες:

Εύκαμπτος πίνακας PCB

άκαμπτο PCB

PCB χαλκού

Άκαμπτο Flex PCB

Πίνακας PCB αργιλίου

PCB hdi

Βαρύ PCB χαλκού

Ρότζερς pcb

Πίνακας PCB οδηγήσεων

Συναρμολόγηση PCB ισχύος

Τύλιγμα PCB

Γρήγορο PCB στροφής

PCB υψηλής συχνότητας

Συνέλευση PCB EMS

Εύκαμπτος πίνακας PCB

άκαμπτο PCB

PCB χαλκού

Άκαμπτο Flex PCB

Πίνακας PCB αργιλίου

PCB hdi

Βαρύ PCB χαλκού

Ρότζερς pcb

Πίνακας PCB οδηγήσεων

Συναρμολόγηση PCB ισχύος

Τύλιγμα PCB

Γρήγορο PCB στροφής

PCB υψηλής συχνότητας

Συνέλευση PCB EMS

products details

HDI PCB PCB Prototype Mass Production Minimum Line Space 0.075mm High Density Interconnect Circuit Board Services

HDI PCB PCB Prototype Mass Production Minimum Line Space 0.075mm High Density Interconnect Circuit Board Services

HDI PCB prototype services

high density interconnect circuit board

PCB mass production 0.075mm

Product Description:

Why Blind Via hole in HDI PCB